Image sensor package and forming method of the same

Details Image sensor package and forming method of the same Image sensor package and forming method of the same

2011-01-04

2011-01-04

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S064000, C438S066000

Reexamination Certificate

active

07863105

ABSTRACT:
An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.

REFERENCES:
patent: 5514888 (1996-05-01), Sano et al.
patent: 7288757 (2007-10-01), Farnworth et al.
patent: 7479627 (2009-01-01), Yoshimoto et al.
patent: 7531443 (2009-05-01), Pratt
patent: 2005/0151228 (2005-07-01), Tanida et al.
patent: 2006/0001147 (2006-01-01), Tomita et al.

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