Image sensor package

Details Image sensor package Image sensor package

2008-09-30

2008-09-30

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S704000, C257S723000

Reexamination Certificate

active

11616287

ABSTRACT:
An image sensor package includes a substrate, a lens module and a bottom cover. Herein the substrate has an upper surface and a lower surface, a plurality of passive components is fabricated on the lower surface and a chip is disposed on the upper surface. The lens module is mounted on the substrate and covers the chip. The bottom cover is connected to the lower surface of the substrate to enclose the passive components.

REFERENCES:
patent: 6683795 (2004-01-01), Yoo
patent: 6952046 (2005-10-01), Farrell et al.
patent: 7105904 (2006-09-01), Choi
patent: 2005/0048692 (2005-03-01), Hanada et al.
patent: 2007/0145569 (2007-06-01), Hsin

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