Image sensor module package structure with supporting element

Details Image sensor module package structure with supporting element Image sensor module package structure with supporting element

2008-05-15

2009-10-06

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C257S704000

Reexamination Certificate

active

07598580

ABSTRACT:
An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a light-sensing area of a first surface thereof, first conducting pads electrically connected to the light-sensing elements, and a conducting channel passing through the chip and electrically connected to the first conducting pads at one end. The supporting element has an opening, a first coupling surface, and a second coupling surface. The opening corresponds to the light-sensing area and the first coupling surface is combined with the first surface of the chip while the light-transmitting element is combined with the second coupling surface. The supporting element separates the light-transmitting element from the chip by a proper distance, so as to enhance an image sensing accuracy of an image sensor module. The chip having the conducting channel effectively facilitates reducing an overall volume of the image sensor module package structure.

REFERENCES:
patent: 7221051 (2007-05-01), Ono et al.
patent: 7297918 (2007-11-01), Chen et al.
patent: 200709444 (1994-08-01), None

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