Image sensor having photo diode and method for manufacturing...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C257S184000

Reexamination Certificate

active

07063998

ABSTRACT:
An image sensor having a photo diode with improved sensitivity, junction leakage and electron capacity, and a method for manufacturing the image sensor, are provided. The provided image sensor includes a semiconductor substrate and a p-type photo diode region formed on a selected region of the semiconductor substrate. A first n-type photo diode region is formed underneath the p-type photo diode region, contacting an interface of the p-type photo diode region, and a second n-type photo diode region is formed to surround the first n-type photo diode region. Here, impurities composing the first n-type photo diode region have smaller projection distance and diffusivity than impurities composing the second n-type photo diode region.

REFERENCES:
patent: 5191399 (1993-03-01), Maegawa et al.
patent: 5500550 (1996-03-01), Morishita
patent: 5563429 (1996-10-01), Isogai
patent: 5686857 (1997-11-01), Heminger et al.
patent: 6610557 (2003-08-01), Lee et al.
patent: 6677656 (2004-01-01), François

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