Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2005-08-23
2005-08-23
Prenty, Mark V. (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S072000
Reexamination Certificate
active
06933167
ABSTRACT:
An image sensor having micro-lenses is disclosed. The image sensor comprises a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element. A micro-lens is formed over each of the light sensitive elements. Finally, a trench structure surrounds each of the micro-lenses.
REFERENCES:
patent: 5371384 (1994-12-01), Wada
patent: 5396090 (1995-03-01), Nakai
patent: 5768023 (1998-06-01), Sawaki
patent: 6274917 (2001-08-01), Fan et al.
patent: 6297071 (2001-10-01), Wake
patent: 6577342 (2003-06-01), Wester
patent: 6818934 (2004-11-01), Yamamoto
patent: 2005/0048690 (2005-03-01), Yamamoto
OmniVision International Holding Ltd
Perkins Coie LLP
Prenty Mark V.
LandOfFree
Image sensor having micro-lens array separated with trench... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Image sensor having micro-lens array separated with trench..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Image sensor having micro-lens array separated with trench... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3459340