Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2003-03-10
2004-05-25
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S687000, C257S678000
Reexamination Certificate
active
06740967
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to an image sensor having an improved package structure, and in particular to an image sensor that has a firm package structure and may be manufactured more conveniently.
2. Description of the Related Art
A general sensor is used to sense signals, which may be optical or audio signals. The sensor of the invention is used to receive image signals or optical signals. After receiving the image signals, the sensor converts the image signals into electrical signals, which are then transmitted to a printed circuit board via a substrate.
Referring to
FIG. 1
, a conventional image sensor includes a substrate
10
, a frame layer
18
, a photosensitive chip
26
, a plurality of wires
28
, and a transparent layer
34
. The substrate
10
has an upper surface
12
on which first terminals
15
are formed, and a lower surface
14
on which second terminals
16
are formed. The frame layer
18
has a first surface
20
and a second surface
22
adhered to the upper surface
12
of the substrate
10
to form a cavity
24
together with the substrate
10
. The photosensitive chip
26
is arranged within the cavity
24
and is mounted to the upper surface
12
of the substrate
10
. Each wire
28
has a first terminal
30
and a second terminal
32
. The first terminals
30
are electrically connected to the photosensitive chip
26
, and the second terminals
32
are electrically connected to the first terninals
15
of the substrate
10
. The transparent layer
34
is adhered to the first surface
20
of the frame layer
18
.
As shown in
FIG. 2
, the first terminals
15
of the substrate
10
project over the upper surface
12
of the substrate
10
, and a gap
29
is left between two adjacent first terminals
15
. Therefore, when the frame layer
18
is adhered to the substrate by an adhesive, the product will be contaminated if the adhesive is not well controlled and flows out from the gaps. Furthermore, because of the gaps
29
, the frame layer
18
may not be firmly adhered to the substrate
10
and may be easily damaged.
SUMMARY OF THE NVENTION
An object of the invention is to provide an image sensor having an improved package structure and improved product quality.
To achieve the above-mentioned object, the invention provides an image sensor including a substrate, a coating layer, a frame layer, a photosensitive chip, multiple wires, and a transparent layer. The substrate has an upper surface formed with first terminals projecting over the upper surface, and a lower surface formed with second terminals. The coating layer is applied to the upper surface to fill between any two adjacent first terminals and to flatten the first terminals. The frame layer is adhered to the coating layer so as to form a cavity together with the substrate. The photosensitive chip has bonding pads and is mounted to the upper surface and within the cavity. The wires electrically connect the bonding pads to the first terminals, respectively. The transparent layer is arranged on the frame layer to cover the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer.
REFERENCES:
patent: 6262479 (2001-07-01), Chou
patent: 6459149 (2002-10-01), Shimoe et al.
Cao Phat X.
Kingpak Technology Inc.
Pro-Techtor Inter-national Services
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