Image sensor comprising a photodiode in a crystalline...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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C257S222000, C257S225000, C257S290000, C257S291000, C257S292000, C257S428000, C257S431000, C257S432000, C257S443000, C257S446000, C257S448000, C257S459000, C257S461000, C257SE27122, C257SE27127, C257SE27130, C257SE27131, C257SE27132, C257SE27133, C257SE27150, C257SE27151, C257SE27152

Reexamination Certificate

active

08044478

ABSTRACT:
Provided is an image sensor. The image sensor can include a readout circuitry on a first substrate. An interlayer dielectric is formed on the first substrate, and comprises a lower line therein. A crystalline semiconductor layer is bonded to the interlayer dielectric. A photodiode can be formed in the crystalline semiconductor layer, and comprises a first impurity region and a second impurity region. A via hole can be formed passing through the crystalline semiconductor layer and the interlayer dielectric to expose the lower line. A plug is formed inside the first via hole to connect with only the lower line and the first impurity region. A device isolation region can be formed in the crystalline semiconductor layer to separate the photodiode according to unit pixel.

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Office Action dated Jun. 7, 2011 in German Application No. 10-2008-046101, filed Sep. 5, 2008.

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