Image sensor assembly and method for fabricating the same

Details Image sensor assembly and method for fabricating the same Image sensor assembly and method for fabricating the same

2005-10-21

2008-09-02

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S737000, C257SE23001

Reexamination Certificate

active

07420267

ABSTRACT:
An assembly device of an image sensor chip is disclosed. A flexible circuit has a die-attached portion, a plurality of bendable portions, and a plurality of bonding portions where the bendable portions extend from the die-attached portion and are connected to the corresponding bonding portions. A plurality of inner leads are formed on the bonding portions. An image sensor chip with bumps is attached to the die-attached portion. The bendable portions are so bent that the bonding portions are located above the image sensor chip. By thermocompression bonding, the inner leads of the flexible circuit are bonded to the bumps on the image sensor chip. In one embodiment, a transparent cover is adhered to the bonding portions and located above a sensing area of the image sensor chip.

REFERENCES:
patent: 6730855 (2004-05-01), Bando
patent: 6964886 (2005-11-01), Kinsman
patent: 2005/0167817 (2005-08-01), Damberg
patent: 459355 (2001-10-01), None
patent: 484237 (2002-04-01), None

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