Image sensor and method for manufacturing the same

Details Image sensor and method for manufacturing the same Image sensor and method for manufacturing the same

2011-01-11

2011-01-11

Ngo, Ngan (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S067000, C438S091000, C438S459000, C438S514000, C257SE21545

Reexamination Certificate

active

07867808

ABSTRACT:
Embodiments relate to an image sensor and a method of manufacturing an image sensor. According to embodiments, an image sensor may include a first substrate, a photodiode, and an ion implantation isolation layer. According to embodiments, circuitry including a metal interconnection may be disposed over the first substrate. A photodiode may be provided in a crystalline semiconductor layer bonded to the first substrate, and electrically connected to the metal interconnection. The ion implantation isolation layer may be provided in the photodiode.

REFERENCES:
patent: 6001664 (1999-12-01), Swirhun et al.
patent: 6852565 (2005-02-01), Zhao
patent: 6960757 (2005-11-01), Merrill et al.
patent: 7005689 (2006-02-01), Song et al.
patent: 7687837 (2010-03-01), Park et al.
patent: 2005/0045925 (2005-03-01), Yoshida et al.
patent: 2005/0062084 (2005-03-01), Han
patent: 2005/0127462 (2005-06-01), Rim et al.
patent: 2006/0214249 (2006-09-01), Nam et al.
patent: 1630089 (2005-06-01), None
patent: 1820349 (2009-08-01), None
patent: 10-2005-0117674 (2005-12-01), None

Affiliated with

Also associated with

Rating

Image sensor and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Image sensor and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Image sensor and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2666561