Image sensor and method for manufacturing the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C257S696000, C438S126000

Reexamination Certificate

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07440263

ABSTRACT:
An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip. And a transparent layer is fixed and encapsulated by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer.

REFERENCES:
patent: 2004/0113049 (2004-06-01), Hsieh et al.
patent: 2004/0140420 (2004-07-01), Dai et al.

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