Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-07-16
2008-10-21
Duong, Hung V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S696000, C438S126000
Reexamination Certificate
active
07440263
ABSTRACT:
An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip. And a transparent layer is fixed and encapsulated by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer.
REFERENCES:
patent: 2004/0113049 (2004-06-01), Hsieh et al.
patent: 2004/0140420 (2004-07-01), Dai et al.
Duong Hung V
Kingpak Technology Inc.
Pro-Techtor Int'l Services
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