Image sensor and manufacturing method thereof

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S414000, C257S432000

Reexamination Certificate

active

07635607

ABSTRACT:
An image sensor and fabricating method thereof are provided. A multi-layered interlayer insulating layer is formed on a substrate including a photodiode, and a metal line is formed in the interlayer insulating layer, such that the metal line passes through the interlayer insulating layer. A conductive barrier layer is formed on the metal line, a color filter array is formed on the interlayer insulating layer and the metal line, and microlenses are formed on the color filter array.

REFERENCES:
patent: 6329275 (2001-12-01), Ishigami et al.
patent: 6379992 (2002-04-01), Jo
patent: 2005/0012166 (2005-01-01), Choi
patent: 2007/0063299 (2007-03-01), Hwang
patent: 10-2004-0115935 (2006-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Image sensor and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Image sensor and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Image sensor and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4066617

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.