Image sensor

Details Image sensor Image sensor

2007-07-24

2009-10-06

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S448000, C257S294000, C257SE31113, C257SE31124

Reexamination Certificate

active

07598583

ABSTRACT:
An image sensor according to embodiments may include a first substrate having photodiode cells, a second substrate having a logic circuit, and connection electrodes that may electrically connect the photodiode cells with the logic circuit. In embodiments, more area may be available on the first substrate for photodiode cells and light loss may be reduced.

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Fukushima, T.[u.]:New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration.In:Jpn.J.Appl.Phys., vol. 45, Nr.4B,Apr. 2006.

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