Image-sensing module for reducing overall thickness thereof...

Details Image-sensing module for reducing overall thickness thereof... Image-sensing module for reducing overall thickness thereof...

2008-12-01

2011-11-08

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S753000, C361S816000, C361S818000, C174S254000

Reexamination Certificate

active

08054639

ABSTRACT:
An image-sensing module for reducing its overall thickness and preventing electromagnetic interference (EMI) includes a flexible substrate, an image sensor, and a plurality of electronic elements. The flexible substrate has a first PCB (Printed Circuit Board), a flexible bending board bent upwards from one side of the first PCB, and a second PCB extending forwards from the flexible bending board and disposed above the first PCB. The second PCB has at least one first opening. The image sensor is electrically disposed on the first PCB, and the image sensor is exposed by the first opening of the second PCB. The electronic elements are selectively electrically disposed on the first PCB and/or on the second PCB so that the electronic elements are disposed between the first PCB and the second PCB.

REFERENCES:
patent: 7350326 (2008-04-01), Hu
patent: 2007/0066099 (2007-03-01), Li

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