Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2005-03-15
2005-03-15
Bali, Vikkram (Department: 2623)
Image analysis
Applications
Manufacturing or product inspection
C382S143000, C382S145000
Reexamination Certificate
active
06868176
ABSTRACT:
In image processing method and device used in, for instance, wire bonding, the amount of positional deviation, which is of between a reference image and a rotated image which is obtained by rotating the reference image by a particular angle, is calculated by pattern matching between such two images, and then a first alignment point is determined based upon the calculated amount of the positional deviation and the rotational angle which is a known quantity. By way of using the first alignment point as a reference, pattern matching is executed between the reference image and an image of a comparative object (a semiconductor device, for instance) that is obtained by imaging the comparative object disposed in an attitude that includes positional deviations in the rotational direction, thus minimizing the error in the detected position of the comparative object.
REFERENCES:
patent: 4737920 (1988-04-01), Ozawa
patent: 5850466 (1998-12-01), Schott
patent: H9-102039 (1997-04-01), None
Bali Vikkram
Kabushiki Kaisha Shinkawa
Koda & Androlia
LandOfFree
Image processing method and device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Image processing method and device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Image processing method and device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3394439