Image processing apparatus with heat dissipating structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S679460, C361S679540, C361S697000, C361S719000, C361S709000, C165S080300, C165S185000, C257S713000, C174S016300, C174S547000

Reexamination Certificate

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07961471

ABSTRACT:
An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at a prescribed distance, the first chassis accommodating a substrate on which high heat generating parts such as a CPU and a chipset are mounted, and the second chassis accommodating low heat generating and low heat resistance parts. Because of this structure, the first chassis and the second chassis are thermally isolated, and the surface area of the apparatus is increased, thereby improving the cooling efficiency of the apparatus.

REFERENCES:
patent: 5949644 (1999-09-01), Park
patent: 6320748 (2001-11-01), Roden et al.
patent: 6365964 (2002-04-01), Koors et al.
patent: 6597569 (2003-07-01), Unrein
patent: 7180747 (2007-02-01), Lee
patent: 2005/0078448 (2005-04-01), Kunz
patent: 2006/0219852 (2006-10-01), Kawai et al.
patent: 2006/0256515 (2006-11-01), Watanabe
patent: 2007/0167055 (2007-07-01), Watanabe
patent: 2007/0285887 (2007-12-01), Chang
patent: 2007/0291450 (2007-12-01), Watanabe
patent: 2006-301816 (2006-11-01), None

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