Image pickup device with non-molded DSP chip and...

Details Image pickup device with non-molded DSP chip and... Image pickup device with non-molded DSP chip and...

2003-01-21

2008-07-29

Hannett, James M (Department: 2622)

Television

Camera, system and detail

Optics

C348S373000, C348S374000, C348S375000, C348S376000

Reexamination Certificate

active

07405760

ABSTRACT:
An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.

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patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 6426283 (2002-07-01), Chen et al.
patent: 6521881 (2003-02-01), Tu et al.
patent: 6558978 (2003-05-01), McCormick
patent: 6768516 (2004-07-01), Yamada et al.
patent: 6841859 (2005-01-01), Thamby et al.
patent: 2001-230397 (2001-08-01), None
patent: 2001-358997 (2001-12-01), None
patent: 2001-245217 (2007-09-01), None

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