Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Patent
1998-01-27
2000-03-21
Tran, Minh Loan
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
257433, 257774, 257696, 257698, H01L 310232
Patent
active
060406127
ABSTRACT:
An image pickup apparatus or method of the present invention decreases the diameter of an image pickup device assembly by decreasing the thickness of the assembly. A conductor lead (inner lead of TAB product) is formed on a terminal of a CCD so as to protrude from the outer periphery of the main frame of an image pickup device body in accordance with the TAB (Tape Automated Bonding) method capable of realizing mass production, a cover glass is set so that an air gap is formed between the CCD and its image pickup plane side, and thereby an image pickup device body is formed. Moreover, the image pickup device body is set to an aperture of a circuit board to connect the conductor lead to a terminal at the circuit board side. Thereby, it is unnecessary to use a conventional box-type package for storing the CCD.
REFERENCES:
patent: 5909054 (1999-06-01), Kozono
Minami Itsuji
Takahashi Kazuaki
Fuji Photo Optical Co., Ltd.
Snider Ronald R.
Tran Minh Loan
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