III-nitride power semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257S192000, C257SE29248, C257SE29246

Reexamination Certificate

active

07408208

ABSTRACT:
A III-nitride power semiconductor device that includes a two dimensional electron gas having a low field region under the gate thereof.

REFERENCES:
patent: 6953954 (2005-10-01), Yoshii et al.
patent: 2002/0017648 (2002-02-01), Kasahara et al.
patent: 2006/0019435 (2006-01-01), Sheppard et al.
Normally Off AlGaN/GaN Low-Density Drain HEMT (LDD-HEMT) With Enhanced Breakdown Voltage and Reduced Current Collapse—Di Song, Jie Liu, Zhiqun Cheng, Wilson C.W. Tang, Kei May Lau, Fellow, IEEE and Kevin J. Chen, Senior Member, IEEE IEEE Electron Device Letters, vol. 28, No. 3, Mar. 2007-pp. 189-191.
Zhang et al., “Effects of surface traps on breakdown voltage and switching speed of GaN power switching HEMTs” in Electron Devices Meeting, IEDM Technical Digest International, Washington, D.C., Dec. 2001.
Shen et al., “AlGaN/AIN/GaN high-power microwave HEMT”, Electron Device Letters, IEEE< Oct. 2001, vol. 22, Issue 10, p. 457-459.
Vellas et al., “High linearity performances of GaN HEMT devices on Si sub at 4 GHz”, Electron Device Letters, IEEE, Aug. 2002, vol. 23, Issue 8, p. 461-463.
Chini et al., “12W/mm power density AlGaN/GaN HEMTs on sapphire sub”, Electronics Letters, Jan. 2004, vol. 40, Issue 1, p. 73-74.
Chu et al., “9.4W/mm power density AlGaN/GaN/HEMTs on free-standing GaN substrates”, Electron Device Letterd, IEEE, Sep. 2004, vol. 25, Issue 9, p. 596-598.
Shealy et al., “An AlGaN high-electron-mobility transistor with an AIN sub-buffer layer”, Phys. Condens. Matter 2002, vol. 14, p. 3499-3509.
PCT International Search Report dated Feb. 7, 2008 issued in PCT Application No. PCT/US07/06930.

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