IC testing method and apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324755, 324754, G01R 3102

Patent

active

060313846

ABSTRACT:
Two contact heads are used to convey IC devices between an IC device testing part E and a contact arm operating stage ST3 and a buffer stage ST4 is interposed between the contact arm operating stage ST3, a loader arm operating stage ST1 and an unloader arm operating stage ST2 and is movable in X-direction. On the buffer stage ST2 are disposed a loader buffer carrier and an unloader buffer carrier, the former transfers untested IC devices from the loader arm operating stage ST1 to the contact arm operating stage ST3 and the latter transfers tested IC devices from the contact arm operating stage ST3 to the unloader arm operating stage ST3.

REFERENCES:
patent: 5172049 (1992-12-01), Kiyokawa et al.
patent: 5470392 (1995-11-01), Yamada et al.
patent: 5650732 (1997-07-01), Sakai
patent: 5865319 (1999-02-01), Okuda et al.

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