IC tag

Details IC tag IC tag

2003-05-14

2009-06-02

Lee, Seung H (Department: 2887)

Registers

Records

Conductive

C235S435000, C235S488000

Reexamination Certificate

active

07540427

ABSTRACT:
The present invention provides an IC tag which has a structure comprising a first adhesive layer formed on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a release agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.

REFERENCES:
patent: 4717438 (1988-01-01), Benge et al.
patent: 5108819 (1992-04-01), Heller et al.
patent: 5142270 (1992-08-01), Appalucci et al.
patent: 5528222 (1996-06-01), Moskowitz et al.
patent: 5767772 (1998-06-01), Lemaire et al.
patent: 5842722 (1998-12-01), Carlson
patent: 5884425 (1999-03-01), Baldwin
patent: 6147604 (2000-11-01), Wiklof et al.
patent: 6270871 (2001-08-01), Scholz et al.
patent: 6569508 (2003-05-01), Babb et al.
patent: 6638635 (2003-10-01), Hattori et al.
patent: 6830193 (2004-12-01), Tanaka
patent: 6888509 (2005-05-01), Atherton
patent: 11078323 (1999-03-01), None
patent: 2000-57292 (2000-02-01), None
patent: 2000-105806 (2000-04-01), None
patent: 2001-14442 (2001-01-01), None
patent: 2001014442 (2001-01-01), None
patent: 2001-167240 (2001-06-01), None

Affiliated with

Also associated with

Rating

IC tag does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC tag, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC tag will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4107824