IC socket with IC package pressing means

Details IC socket with IC package pressing means IC socket with IC package pressing means

1984-02-28

1985-05-07

McQuade, John

Geometrical instruments

339 17CF, H01R 909

Patent

active

045154252

ABSTRACT:
An IC socket with IC package pressing means comprises a socket substrate, an IC package pressing plate having one end thereof pivotally link-connected to one end of the socket substrate, and an operative lever having one end thereof pivotally link-connected to the other end of the IC package pressing plate and provided with engaging claw pieces which collide against the other end of the socket substrate, lead the IC package pressing plate and the operative lever to their respective laid-down positions relative to the socket substrate and engage with the aforementioned other end of the socket substrate.

REFERENCES:
patent: 239191 (1881-03-01), Ransom
patent: 4456318 (1984-06-01), Shibata et al.
IBM Technical Disclosure Bulletin, vol. 13, No. 5, 10-1970, "Insertion/Extraction Test Socket", Bruder.

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