IC socket with attached electronic component

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S739000, C438S108000

Reexamination Certificate

active

08051554

ABSTRACT:
An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.

REFERENCES:
patent: 3538580 (1970-11-01), Bruner
patent: 4461073 (1984-07-01), Harringer et al.
patent: 5352130 (1994-10-01), Nagumo
patent: 5500605 (1996-03-01), Chang
patent: 5870820 (1999-02-01), Arakawa et al.
patent: 6539622 (2003-04-01), Hidese et al.
patent: 6710612 (2004-03-01), Farnworth et al.
patent: 6769469 (2004-08-01), Yamada
patent: 6842974 (2005-01-01), Maenishi et al.
patent: 6904671 (2005-06-01), Farrens et al.
patent: 6924174 (2005-08-01), Koizumi et al.
patent: 7430798 (2008-10-01), Koizumi et al.
patent: 7477063 (2009-01-01), Wu
patent: 3007148 (1994-11-01), None
patent: 10-97887 (1998-04-01), None
patent: 2001264383 (2001-09-01), None
Office Action dated May 26, 2009, issued in corresponding Korean Application No. 10-2003-0064903.

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