IC socket suitable for BGA/LGA hybrid package

Details IC socket suitable for BGA/LGA hybrid package IC socket suitable for BGA/LGA hybrid package

2007-05-11

2010-10-12

Chung-Trans, Xuong M (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S700000, C324S761010

Reexamination Certificate

active

07811096

ABSTRACT:
An IC socket is provided with first and second contact pins and a socket body supporting said first and second contact pins. The first contact pin is used to establish a connection with a first terminal of a semiconductor package, while the second contact pin is used to establish a connection with a second terminal of said semiconductor package. The first and second terminals have different heights from a mount face of the semiconductor package.

REFERENCES:
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patent: 5990697 (1999-11-01), Kazama
patent: 6354844 (2002-03-01), Coico et al.
patent: 7053496 (2006-05-01), Stone
patent: 7220134 (2007-05-01), Goodman et al.
patent: 2002/0149121 (2002-10-01), Shikano et al.
patent: 11-86992 (1999-03-01), None
patent: 2001-196144 (2001-07-01), None
patent: 2002-246131 (2002-08-01), None
patent: 2003-123923 (2003-04-01), None

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