IC socket structure

Details IC socket structure IC socket structure

1991-10-17

1993-01-05

Bradley, Paula A.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 72, 439 73, 439329, 439330, H01R 909

Patent

active

051765241

ABSTRACT:
An IC socket structure suitable for supporting a surface-mount type of IC (integrated circuit) package includes an IC socket having electrical contacts disposed in corresponding relation to pins of the IC package, the electrical contacts being elastically held, a printed board on which a peripheral circuit associated with the IC package is disposed, the printed board having lands disposed in locations corresponding to the respective pins of the IC package and electrically connected to the peripheral circuit, and a lid having a projection and covering the IC socket. The lid fixes the IC package in such a manner that the printed board and the pins of the IC package are pressed in contact with each other between the electrical contacts of the IC socket and the projection of the lid with the pins of the IC package maintained in electrical contact with the lands of the printed board.

REFERENCES:
patent: 3678385 (1972-07-01), Bruner
patent: 4744009 (1988-05-01), Grabbe et al.
patent: 4997377 (1991-03-01), Goto et al.

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