Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-07-09
2000-12-26
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439489, H01R 909
Patent
active
061649821
ABSTRACT:
An IC socket for holding an IC having multiple parallel lead units and multiple pins each of which includes a tip unit that is bent with respect to the lead unit is equipped with a contact pin for contacting the lead units and a pressing unit for pressing the lead units onto the contact pin. The tip unit may have a soldering unit to be soldered to an object part. The pressing unit is installed at a position that faces the contact pin. The lead units are installed between the pressing unit and the contact pin. The contact pin has elasticity against a direction in which the pressing unit presses the lead units. In order for the contact pin to have this elasticity, the contact pin may have a hollow tube, a spring installed inside the tube, and an axis that the spring presses in an extending direction of the spring. The IC further has a conductive support pin, which supports the IC. A detection pin detects that the IC has been properly installed when the detection pin is electrically connected to the support pin. The multiple contact pins may be installed in a staggered arrangement. The IC socket may further have a holding unit for holding the contact pins. The contact pins may protrude out of the holding unit.
REFERENCES:
patent: 4396935 (1983-08-01), Schuck
patent: 4758176 (1988-07-01), Abe et al.
patent: 5205756 (1993-04-01), Myers
patent: 5247250 (1993-09-01), Rios
patent: 5489854 (1996-02-01), Buck et al.
patent: 5500605 (1996-03-01), Chang
patent: 5841640 (1998-11-01), Shibata
patent: 5893762 (1999-04-01), Kajiwara et al.
Advantest Corporation
Duverne J. F.
Nguyen Khiem
LandOfFree
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