Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-08-25
2009-08-18
Duverne, Jean F (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07575440
ABSTRACT:
An IC socket (1) mounted on a system board (4) for connecting an IC package comprises a socket body (2) defining an upper interface (21) for receiving the IC package and a bottom mounting surface (22) opposite to the interface (21), and a plurality of contacts (3) received in the socket body (2). The socket body (2) has at least one undercut (26) at the bottom thereof for accommodating other elements (5) on the system board (4).
REFERENCES:
patent: 6695625 (2004-02-01), Ma et al.
patent: 6743037 (2004-06-01), Kassa et al.
patent: 6884088 (2005-04-01), Kajinuma et al.
patent: 7210225 (2007-05-01), Olson et al.
patent: 7377792 (2008-05-01), Ma
patent: 2005/0059276 (2005-03-01), Lee et al.
patent: 2005/0064739 (2005-03-01), Searls et al.
Chung Wei Te
Duverne Jean F
Hon Hai - Precision Ind. Co., Ltd.
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