IC socket assembly with improved heat sink

Details IC socket assembly with improved heat sink IC socket assembly with improved heat sink

2005-02-15

2005-02-15

Gushi, Ross (Department: 2833)

Electrical connectors

Having retainer or passageway for fluent material

Liquid material to dissipate, remove, or block the flow of heat

C439S487000

Reexamination Certificate

active

06854993

ABSTRACT:
An integrated circuit (IC) socket assembly (1) includes an IC socket (4) mounted on a burn-in board (3) and receiving an IC (2) therein, a supporting member (5) assembled on the burn-in board and covering the IC socket, a heat sink (6) assembled on the supporting member, and an actuation member (7) assembled on the supporting member. The heat sink includes a jacket (61) attached on the IC. The jacket defines a U-shaped channel for containing cooling liquid therein. The actuation member is capable of being operated from an open position to a closed position, in which the jacket abuts against a top surface of the IC and the IC is reliably electrically connected with the burn-in board. During burning in, the jacket can quickly efficiently dissipate heat from the IC and associated components the protect the IC from instability and damage.

REFERENCES:
patent: 4166665 (1979-09-01), Cutchaw
patent: 4975766 (1990-12-01), Umezawa
patent: 5854738 (1998-12-01), Bowler
patent: 6449157 (2002-09-01), Chu
patent: 6466443 (2002-10-01), Chen
patent: 6497582 (2002-12-01), Hoffmeyer
patent: 20020023733 (2002-02-01), Hall et al.

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