IC socket and spring means of IC socket

Details IC socket and spring means of IC socket IC socket and spring means of IC socket

2002-11-29

2004-04-13

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S762010

Reexamination Certificate

active

06720783

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to IC sockets used for burn-in tests on ICs, such as BGA and LGA, where terminals are formed on a top or bottom surface of their package.
2. Description of the Prior Art
The applicant of the present application have invented an IC socket
100
as depicted in
FIGS. 37-38
and filed a patent application (see Japanese Patent Application No. Hei 10-62228 (62228 of 1998)). This IC socket
100
includes an insulative resin film
103
where a circuit pattern (not show) corresponding to a bump (solder ball)
102
of an IC
101
is formed; a support board
104
made of an insulative resin for supporting the insulative resin film
103
; and a terminal pin unit
105
having its top end connected to said circuit pattern and its bottom end connected to an electrical test circuit (not shown). On the back side of the insulative resin film
103
having the IC
101
disposed thereon is placed a silicone rubber plate
106
. And a pressure member
107
is pivotally attached via a socket body
108
to the top surface of the support board
104
.
The IC socket as described above is such that when the IC
101
is pressed downward by the pressure member
107
, the bump
102
of the IC
101
elastically deforms (dents) the silicone robber plate
106
, so that the elastic restoring force of the silicone rubber plate
106
permits the bump
102
of the IC
101
and the circuit pattern to come into contact with a desired contact pressure. The IC socket
100
electrically connects the IC
101
and external electrical test circuit (not shown) via the terminal pin unit
105
and circuit pattern, thereby allowing for accurate burn-in tests and so forth.
However, with the above IC socket
100
, if burn-in tests and so forth are repeated at temperatures of about 150° C., the elastic restoring force of the silicone rubber plate
106
degrades, thereby possibly reducing the contact stability between the bump
12
and circuit pattern. Accordingly, it is desired that an IC socket with greater durability be provided.
SUMMARY OF THE INVENTION
The present invention is invented to meet the market requirements as described above, and the object of the present invention is to provide an IC socket with superior durability that can maintain contact stability between the bump and circuit pattern even after it is repeatedly used more frequently than the prior IC socket.
A first aspect of the present invention is an IC socket, which comprises: an insulative resin film that is elastically deformable, where a plurality of conductive contact pads are formed so as to correspond to a plurality of IC terminals and a circuit pattern is formed to electrically connect said contact pads and an external electrical test circuit; a support board that supports a surface opposite to a surface where said contact pads of the insulative resin film are formed; an IC pressing means, attached to said support board to press the IC terminals against the contact pads of said insulative resin film; and a spring means for pressing said contact pads against said IC terminals pressed by said IC pressing means. Further, said spring means comprises a spiral cantilever formed in an elastically deformable metal plate fixed to the surface of said support board opposite to said insulative resin film. The tip of this spiral cantilever presses said contact pad against said IC terminal via said insulative resin film.
A second aspect of the present invention is such that said spiral cantilever is formed so that its height increases toward its tip according to the first aspect of the invention.
A third aspect of the present invention is such that the tip of said spiral cantilever is formed to be flat according to the second aspect of the invention.
A fourth aspect of the present invention is such that said spiral cantilever has a dome formed on its tip, said dome protruding toward said insulative resin film, and an escape hole that allows flexible deformation of said spiral cantilever is formed on the surface of said support board opposite to said insulative resin film according to the first aspect of the invention.
A fifth aspect of the present invention is an IC socket, which comprises: an insulative resin film that is elastically deformable, where a plurality of conductive contact pads are formed so as to correspond to a plurality of IC terminals and a circuit pattern is formed to electrically connect said contact pads and an external electrical test circuit; a support board that supports a surface of said insulative resin film opposite to a surface where said contact pads are formed; an IC pressing means, attached to said support board to press the IC terminals against the contact pads of said insulative resin film; and a spring means for pressing said contact pads against said IC terminals pressed by said IC pressing means. Said spring means comprises a cantilever that is cut and raised from an elastically deformable metal plate fixed to the surface of said support board opposite to said insulative resin film, and the tip of the cantilever presses said contact pad against said IC terminal via said insulative resin film.
A sixth aspect of the present invention is such that said metal plate consists of a first metal plate where odd rows of cantilevers are formed and a second metal plate where even rows of cantilever are formed according to the fifth aspect of the invention.
A seventh aspect of the present invention is an IC socket, which comprises: an insulative resin film that is elastically deformable, where a plurality of conductive contact pads are formed so as to correspond to a plurality of IC terminals and a circuit pattern is formed to electrically connect said contact pads and an external electrical test circuit; a support board that supports a surface opposite to a surface where said contact pads of the insulative resin film are formed; an IC pressing means, attached to said support board to press the IC terminals against the contact pads of said insulative resin film; and a spring means for pressing said contact pads against said IC terminals pressed by said IC pressing means. Said spring means is such that a plate-shaped member is cut and raised from an elastically deformable metal plate fixed to the surface of said support board opposite to said insulative resin film, the tip of the plate-shaped member is formed so that it can slide over said support board, a curved portion that protrudes toward said insulative resin film is bent and formed between the tip and root of the plate-shaped member, and the crest of the curved portion presses said contact pad against said IC terminal via said insulative resin film.
An eighth aspect of the present invention is an IC socket, which comprises: an insulative resin film that is elastically deformable, where a plurality of conductive contact pads are formed so as to correspond to a plurality of IC terminals and a circuit pattern is formed to electrically connect said contact pads and an external electrical test circuit; a support board that supports a surface of said insulative resin film opposite to a surface where said contact pads are formed; an IC pressing means, attached to said support board to press the IC terminals against the contact pads of said insulative resin film; and a spring means for pressing said contact pads against said IC terminals pressed by said IC pressing means. Said spring means comprises an opposing pair of cantilevers that are cut and raised from an elastically deformable metal plate fixed to the surface of said support board opposite to said insulative resin film. The tips of this pair of cantilevers press said contact pad against said IC terminal via said insulative resin film.
A ninth aspect of the present invention is an IC socket, which comprises: an insulative resin film that is elastically deformable, where a plurality of conductive contact pads are formed so as to correspond to a plurality of IC terminals and a circuit pattern is formed to electrically connect said contact pads and an extern

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