Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-03-03
1997-02-04
Pirlot, David L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 73, H01R 900
Patent
active
055991947
ABSTRACT:
A contact pin having a thin wall construction that makes good electrical connection with an IC socket without insulation due to oxide film forming on the surface of the lead and which does not easily break due to plastic deformation. An IC socket has a feature to prevent an IC device position from deviating and deforming its leads which can automatically position the IC device for secure contact with contact pins of an IC frame having leads by limited positioning of the IC device on a stage.
REFERENCES:
patent: 4959029 (1990-09-01), Grabbe
patent: 4995816 (1991-02-01), Grabbe
patent: 5240421 (1993-08-01), Uratsuji
Harada Hiroaki
Ozawa Kazuhisa
Enplas Corporation
O'Reilly David
Pirlot David L.
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