Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-08-18
1994-08-09
Bradley, P. Austin
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 82, 439330, H01R 909
Patent
active
053360966
ABSTRACT:
A contact pin having a thin wall construction that makes good electrical connection with an IC socket without insulation due to oxide film forming on the surface of the lead and which does not easily break due to plastic deformation. An IC socket has a feature to prevent an IC device position from deviating and deforming its leads which can automatically position the IC device for secure contact with contact pins of an IC frame having leads by limited positioning of the IC device on a stage.
REFERENCES:
patent: 4750890 (1988-06-01), Dube et al.
patent: 4824389 (1989-04-01), Doyle et al.
patent: 4959029 (1990-09-01), Grabbe
patent: 4995816 (1991-02-01), Grabbe
patent: 5154619 (1992-10-01), Matsuoka
Harada Hiroaki
Ozawa Kazuhisa
Bradley P. Austin
Enplas Corporation
O'Reilly David
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