IC socket and IC package mounting device

Details IC socket and IC package mounting device IC socket and IC package mounting device

2007-07-20

2009-12-22

Leon, Edwin A. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07635268

ABSTRACT:
An IC socket includes a plurality of contacts each including a spring formed by winding a conductive material around a winding axis with an effective winding number of at least 1 round, and arms provided on both ends of the spring, and a housing including the same number of holes as the plurality of contacts, the holes each having one of the contacts inserted therein in a state in which the spring is compressed in a direction of the winding axis so as to allow adjacent coil portions in the spring to come into contact with each other and to be electrically conductive.

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patent: 7052284 (2006-05-01), Liao et al.
patent: 7338294 (2008-03-01), Polnyi
patent: 2003/0040201 (2003-02-01), Ishizuka et al.
patent: 2007/0099445 (2007-05-01), Li
patent: 8-203644 (1996-08-01), None
patent: 2002-14113 (2002-01-01), None
patent: 2004-39564 (2004-02-01), None
patent: 2004-158430 (2004-06-01), None
patent: 2005-19284 (2005-01-01), None

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