Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-11-18
1998-09-29
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
058138692
ABSTRACT:
An IC socket capable of being used commonly with various ICs having different sizes is provided. Four insulation blocks 12A, 12B, 12C and 12D which may be assembled together into a generally rectangular framing are prepared. Contact arrays 11A, 11B, 11C and 11D of the IC socket to be contacted by the leads on the respective sides of a surface-mounted type IC are separately supported by the four insulation blocks, respectively. The four insulation blocks have positioning lugs 15 formed on the bottom surfaces thereof which are adapted to engage with mating through-holes 14 formed through the insulation substrate 13 to mount the four insulation blocks to the insulation substrate 13 in the form of a generally rectangular framing.
REFERENCES:
patent: 4433886 (1984-02-01), Cassarly et al.
patent: 4552422 (1985-11-01), Bennett et al.
patent: 5078626 (1992-01-01), Matsuoka et al.
patent: 5273442 (1993-12-01), Laub
patent: 5352131 (1994-10-01), Nagumo
Abrams Neil
Advantest Corporation
Patel T. C.
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