Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-05-13
1993-07-13
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 909
Patent
active
052268241
ABSTRACT:
A chip carrier socket (2) for use with an integrated circuit chip carrier (80). The chip carrier (80) has spaced apart contact leads (82) which extend from respective side walls of the chip carrier (80). The socket (2) has a recess (20) for reception of the chip carrier (80) therein. Contact receiving slots (34) are positioned in surrounding relationship to the recess (20) and have contacts (5) disposed therein. Each contact (5) has a generally S-shaped contacting section (52) which cooperates with the corresponding lead (82) of the chip carrier (80), and a mounting section (54) which cooperates with a circuit board on which the socket is seated. A retention section (62) extends upward from an outer end of the mounting section (54) for fastening the contacting section (52) to the socket (2). A reference section (66) laterally extends outward from the lower portion of the retention section (62) to the outside for functioning as a stopper for positioning of the contact or as a testing portion for contacting a probe which is used to collect the data for checking the status of the contact (5).
REFERENCES:
patent: 4341433 (1982-07-01), Cherian et al.
Ching Heng
Karlovich Robert
Bradley Paula A.
Foxconn International, Inc.
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