IC socket

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

Reexamination Certificate

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Details

C439S055000, C439S086000, C361S760000

Reexamination Certificate

active

10471118

ABSTRACT:
The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. The IC socket is obtained by molding or otherwise forming a thermoplastic resin composition comprising 40 to 94% by mass of a thermoplastic resin, 5 to 30% by mass of a carbon precursor having a volume resistivity of 102to 1010Ω·cm and 1 to 30% by mass of an electrical conductive filler having a volume resistivity of less than 102Ω·cm.

REFERENCES:
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patent: 5226824 (1993-07-01), Karlovich et al.
patent: 5745346 (1998-04-01), Ogawa et al.
patent: 6545081 (2003-04-01), Nishihata et al.
patent: 05-129480 (1993-05-01), None
patent: 07-179758 (1995-07-01), None
patent: 08-176441 (1996-07-01), None
patent: 08-176442 (1996-07-01), None
patent: 09-087418 (1997-03-01), None
patent: 11-323131 (1999-11-01), None
patent: 2000150094 (2000-05-01), None
patent: 2000212453 (2000-08-01), None
patent: WO 00/34369 (2000-06-01), None

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