Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-06-13
2006-06-13
Nguyen, Truc (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S331000, C324S755090
Reexamination Certificate
active
07059870
ABSTRACT:
An IC socket includes a package guide member including a package receiving part configured to arrange a semiconductor device where a plurality of external connection terminals are arranged in a single plane surface at a designated position, a contact terminal having a tip arranged so as to correspond to a position of the corresponding external connection terminal when the semiconductor device is received in the package receiving part where the external connection terminals are situated at a lower side, a contact terminal supporting member situated separately from the package guide member, the contact terminal supporting member being configured to support the contact terminal, a wiring member configured to electrically connect to the contact terminal, a position adjustment mechanism configured to adjust and fix the position of the contact terminal supporting member to the package guide member, and a wiring unit having an electrode as corresponding to the wiring member, the wiring unit being fixed to a testing wiring substrate.
REFERENCES:
patent: 4931020 (1990-06-01), Matsuoka et al.
patent: 5573418 (1996-11-01), Matsuoka
patent: 6220870 (2001-04-01), Barabi et al.
patent: 5-249182 (1993-09-01), None
patent: 9-211067 (1997-08-01), None
patent: 2000-260910 (2000-09-01), None
patent: 2002-164136 (2002-06-01), None
Cooper & Dunham LLP
Nguyen Truc
Ricoh & Company, Ltd.
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