Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-08-01
2006-08-01
Gushi, Ross (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S066000
Reexamination Certificate
active
07083429
ABSTRACT:
An IC socket includes an insulative housing having an IC package receiving recess, in which an IC package is received. Contacts are disposed within cavities, which are provided in the IC package receiving recess in a matrix arrangement. Each contact includes a base which is installed into a cavity, an upwardly extending contact arm, which is offset above a cavity and a downwardly extending terminal portion, for electrically connecting with a circuit board. The insulative housing includes first partition walls which are provided between rows of cavities adjacent to each other in the first direction and second partition walls which are provided between rows of cavities adjacent to each other in a second direction perpendicular to the first direction, the first partition walls having greater heights than those of the second partition walls.
REFERENCES:
patent: 4761140 (1988-08-01), Geib
patent: 6132220 (2000-10-01), McHugh et al.
patent: 6186797 (2001-02-01), Wang et al.
patent: 6293806 (2001-09-01), Yu
patent: 6561819 (2003-05-01), Huang et al.
patent: 6604950 (2003-08-01), Maldonado et al.
patent: 6626683 (2003-09-01), Lai
patent: 6638078 (2003-10-01), Hashiguchi et al.
patent: 6695624 (2004-02-01), Szu
patent: 6758683 (2004-07-01), Koopman et al.
patent: 6776642 (2004-08-01), McHugh et al.
patent: 6805561 (2004-10-01), Walkup et al.
patent: 6811408 (2004-11-01), Achammer et al.
patent: 6824396 (2004-11-01), Koopman et al.
patent: 6827586 (2004-12-01), Noda et al.
patent: 6887114 (2005-05-01), Liao
patent: 6905377 (2005-06-01), Murr
patent: 6908313 (2005-06-01), Walkup et al.
patent: 6914192 (2005-07-01), Ju
patent: 2002/0182901 (2002-12-01), Koopman et al.
patent: 2005/0014398 (2005-01-01), Liao et al.
patent: 2005/0042940 (2005-02-01), Liao
patent: 2005/0054218 (2005-03-01), Liao et al.
patent: 5(1993)-90378 (1993-12-01), None
Hashimoto Shin'ichi
Shirai Hiroshi
Barley Snyder LLC
Gushi Ross
Tyco Electronics AMP K.K
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