Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-11-29
2005-11-29
Luebke, Renee (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06969262
ABSTRACT:
An IC socket formed by attaching a socket frame to a test board via a contact sheet, wherein the contact sheet has a plurality of cantilever spring type contacts arranged on a insulation film and a spacer member, to tightly attach the socket frame to the test board via the contact sheet without any inclination.
REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5297967 (1994-03-01), Baumberger et al.
patent: 5629837 (1997-05-01), Barabi et al.
patent: 6474997 (2002-11-01), Ochiai
patent: 06-313788 (1994-11-01), None
patent: 08-018292 (1996-01-01), None
patent: 08-068829 (1996-03-01), None
patent: 10-022024 (1998-01-01), None
patent: 11-204223 (1999-07-01), None
Ito Takehiro
Suzuki Katsumi
Finnegan Henderson Farabow Garrett & Dunner LLP
Luebke Renee
Yamaichi Electronics Co. Ltd.
LandOfFree
IC socket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC socket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3496071