IC socket

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Reexamination Certificate

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06969262

ABSTRACT:
An IC socket formed by attaching a socket frame to a test board via a contact sheet, wherein the contact sheet has a plurality of cantilever spring type contacts arranged on a insulation film and a spacer member, to tightly attach the socket frame to the test board via the contact sheet without any inclination.

REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5297967 (1994-03-01), Baumberger et al.
patent: 5629837 (1997-05-01), Barabi et al.
patent: 6474997 (2002-11-01), Ochiai
patent: 06-313788 (1994-11-01), None
patent: 08-018292 (1996-01-01), None
patent: 08-068829 (1996-03-01), None
patent: 10-022024 (1998-01-01), None
patent: 11-204223 (1999-07-01), None

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