Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-10-11
2005-10-11
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C333S260000
Reexamination Certificate
active
06953348
ABSTRACT:
An IC socket receives an IC provided with arrayed terminals. In the IC socket, a conductive block is formed with a first face opposing to the received IC, and a plurality of holes arrayed in association with the terminals of the received IC. Each of a plurality of contact probes is disposed in each of the holes, and is provided with a conductive pipe, and a conductive plunger, retractably provided at a first end of the pipe, the plunger being to be brought into contact with an associated one of the terminals. A retainer provided with an insulative member through which the pipe is coaxially held within an associated one of the holes while forming a gap between an outer periphery of the pipe and an interior wall of the associated one of the holes. At least one of the contact probes to be brought into contact with an RF signal terminal among the terminals of the received IC is retained by the retainer.
REFERENCES:
patent: 5302923 (1994-04-01), Mason et al.
patent: 6102709 (2000-08-01), Howard et al.
patent: 6776623 (2004-08-01), Yunker et al.
patent: 6844749 (2005-01-01), Sinclair
patent: 2001-99889 (2004-04-01), None
Sato Atsushi
Suzuki Mitsuhiro
Yanagisawa Wasuke
Yoshida Takuto
Morgan & Lewis & Bockius, LLP
Nguyen Khiem
Yokowo Co., Ltd.
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