Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-09-27
2005-09-27
Dinh, Phuong (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06948946
ABSTRACT:
An IC socket includes an insulating housing having a plurality of wall blocks defining a plurality of slanting passageways penetrating inclined therethrough and a limit portion downwardly extending therefrom, a plurality of contacts received correspondingly in the slanting passageways respectively, and at least two orientation posts disposed downwardly from the limit portion. Each of the contacts is resilient and in an U shape, and has fist and second abutting portions exposing out of opposing sides of the bottom wall of the insulating housing respectively. The IC module accommodates with the insulating housing, the PCB and the IC modules include a plurality of conductive patterns and pads disposed thereon respectively, so as to correspond to the contacts relatively, the first abutting portion consequently retains against each of the conductive patterns and the second abutting portion retains against each of the pads.
REFERENCES:
patent: 5106309 (1992-04-01), Matsuoka et al.
patent: 5352131 (1994-10-01), Nagumo
patent: 6062874 (2000-05-01), Matsuda et al.
patent: 6152744 (2000-11-01), Maeda
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