Electrical connectors – Coupling part having handle or means to move contact...
Reexamination Certificate
1999-02-02
2001-04-10
Nguyen, Khiem (Department: 2839)
Electrical connectors
Coupling part having handle or means to move contact...
Reexamination Certificate
active
06213803
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to an IC socket having a single contact capable of contacting an external contact point of an IC package, which single contact includes a pressure applying arm and a pressure receiving arm such that the external contact point is brought into contact, under pressure, with the pressure receiving arm by the pressing force of the pressure applying arm.
2. Related Art
In an IC socket discussed in Japanese Patent Publication No. Hei 3-24035, a contact includes a pair of pinchingly holding pieces raised in parallel relation from a basal portion thereof, each pinchingly holding piece being elastically displaced forwardly and backwardly through a spring specific to each pinchingly holding piece. This pinchingly holding piece pair pinchingly holds an upper and a lower surface of an external contact point of an IC package, thereby constituting an IC socket of a two-point contact structure. The front side opposing pinchingly holding piece is in position for storing an elastic force in an opposing direction and in abutment with a lower surface of the external contact point, while the rear side pinchingly holding piece is elastically displaced forwardly and backwardly by upward and downward movement of a contact opening/closing member (releasing member) such that when displaced forwardly, the rear side pinchingly holding piece is brought into contact, under pressure, with an upper surface of the IC external contact point, thereby forming the two-point contact structure together with the front side pinchingly holding piece.
However, the above conventional IC socket has such shortcomings that the level of the contact surface of the front side pinchingly holding piece with respect to a lower surface of the external contact point of the IC package is not constant, thereby making it unable to provide a stable contact relation with the external contact point, with a result that the external contact point will be deformed by a pressing pressure of the rear side pinchingly holding piece.
The present invention has been accomplished in view of the above problems inherent in the conventional IC packages.
SUMMARY OF THE INVENTION
It is, therefore, an object of the present invention to provide an IC package in which a reliable contact relation with an external contact point of an IC package is ensured.
A specific object of the present invention is to provide an IC package capable of providing a constant contacting level with an external contact point of an IC package.
A further object of the present invention is to provide an IC package in which an external contact point of an IC package is prevented from being deformed.
In order to achieve the above objects, from one aspect of the present invention, there is essentially provided an IC socket including a plurality of contacts arranged in such a manner as to be able to contact an external contact point of an IC package. The contacts each including a pressure applying arm for exerting a downward force to the external contact point while being in contact, under pressure with the external contact point, and a pressure receiving arm having a load receiving portion for receiving the external contact point while being in contact, under pressure with the external contact point against a pressing force of the pressure applying arm, the pressure receiving arm is provided on the load receiving portion with a downward movement preventive portion engageable with a socket body to set a loading level of the load receiving portion, wherein the downward movement preventive portion is formed by a downwardly facing surface of the load receiving portion. The load receiving portion is pulled up against an elastic force of the pressure receiving arm such that the downwardly facing surface is in elastic engagement with an upwardly facing surface of the socket body, and a connecting portion between the pressure receiving arm and the load receiving portion is provided with a forward movement preventive portion capable of elastically engaging with the socket body to restrict the forward movement of the load receiving portion.
From another aspect of the present invention, there is also provided an IC socket including a plurality of contacts arranged in such a manner as to be able to contact an external contact point of an IC package. The contacts each include a pressure applying arm for exerting a downward force to the external contact point while being in contact, under pressure with the external contact point, and a pressure receiving arm having a load receiving portion for receiving the external contact point while being in contact, under pressure with the external contact point against a pressing force of the pressure applying arm. The pressure receiving arms being provided on the load receiving portion with a downward movement preventive portion engageable with a socket body to set a loading level of the load receiving. portion, wherein the load receiving portion is moved downwardly, by pressure from the pressure applying arm, to bring the downward movement preventive portion into engagement with the socket body, and a connecting portion between the pressure receiving arm and the load receiving portion is provided with a forward movement preventive portion capable of elastically engaging with the socket body to restrict the forward movement of the load receiving portion.
From a further aspect of the present invention, there is also provided an IC socket including a plurality of contacts arranged in such a manner as to be able to contact an external contact point of an IC package. The contacts each include a pressure applying arm for exerting a downward force to the external contact point while being in contact, under pressure with the external contact point, and a pressure receiving ann having a load receiving portion for receiving the external contact point while being in contact, under pressure with the external contact point against a pressing force of the pressure applying arm. The pressure receiving arm being provided on the load receiving portion with a downward movement preventive portion engageable with a socket body to set a loading level of the load receiving portion, wherein the downward movement preventive portion being formed by a downwardly facing surface of the load receiving portion. The load receiving portion is pulled up against an elastic force of the pressure receiving arm such that the downwardly facing surface is in elastic engagement with an upwardly facing surface of the socket body, and a connecting portion between the pressure receiving arm and the load receiving portion is provided with a forward movement preventive portion capable of elastically engaging with the socket body to restrict the forward movement of the load receiving portion.
From a still further aspect of the present invention, there is also provided an IC socket including a plurality of contacts arranged in such a manner as to be able to contact an external contact point of an IC package. The contacts each include a pressure applying arm for exerting a downward force to the external contact point while being in contact, under pressure with the external contact point, and a pressure receiving arm having a load receiving portion for receiving the external contact point while being in contact, under pressure with the external contact point against a pressing force of the pressure applying arm. The pressure receiving arm is provided on the load receiving portion with a downward movement preventive portion engageable with a socket body to set a loading level of the load receiving portion. The load receiving portion is moved downwardly, by pressure from the pressure applying arm, to bring the downward movement preventive portion into engagement with the socket body, and a connecting portion between the pressure receiving arm and the load receiving portion is provided with a forward movement preventive portion capable of elastically engaging with the socket body to restrict the forward movement of the load receivi
Hayakawa Nanahiro
Kato Yuji
Nguyen Khiem
Wenderoth , Lind & Ponack, L.L.P.
Yamaichi Electronics Co. Ltd.
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