Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-01-11
1994-09-20
Bishop, Steven C.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439266, 439525, 439526, 439330, H01R 2372
Patent
active
053484835
ABSTRACT:
An IC socket comprising a plurality of partition walls disposed along an IC platform and contacts which are to be brought into pressure contact with leads of an IC package mounted on the IC platform, the contacts being inserted into corresponding slits formed between adjacent the partition walls so that the contacts are orderly arranged with respect to the leads of the IC package, a foremost end face of each of the leads of the IC package being restricted by wall surfaces of a pair of adjacent partition walls for isolating the slits so that the leads are correctly positioned.
REFERENCES:
patent: 4846704 (1989-07-01), Ikeya
patent: 4931020 (1990-06-01), Matsuoka et al.
patent: 5026303 (1991-06-01), Matsuoka et al.
Bishop Steven C.
Yamaichi Electronics Co. Ltd.
LandOfFree
IC socket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC socket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2429419