Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-02-18
1994-12-20
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439330, H01R 2372
Patent
active
053741978
ABSTRACT:
An IC socket including a socket body and an IC receiving portion formed in the socket body and having an open top at an upper surface of the socket body and an open bottom at a lower surface thereof, the IC being loaded into the IC receiving portion through the open bottom, the improvement comprising a lifter for lifting the IC into a raised-position within the IC receiving portion, contacts arranged on the socket body so as to be pressure contacted with contacting elements of the IC by a lifting force of the lifter applied to the IC, and engagement means for engaging the lifter so that the IC is held in the raised-position.
REFERENCES:
patent: 4750890 (1988-06-01), Dube et al.
patent: 4846703 (1989-07-01), Matsuoka et al.
patent: 5176524 (1993-01-01), Mizuno et al.
patent: 5290192 (1994-03-01), Espenshade et al.
patent: 5301416 (1994-04-01), Foerstel
patent: 5306167 (1994-04-01), Nagumo
Paumen Gary F.
Wittels Daniel
Yamaichi Electronics Co. Ltd.
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