Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-09-23
2000-09-26
Luebke, Renee
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 1200
Patent
active
061235520
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an IC socket used for inspecting the electrical properties of a semiconductor device such as a LSI and a bare chip.
BACKGROUND ART
With advances in densification of semiconductor devices, the demand is rapidly increasing for IC packages such as a ball grid array (BGA) or pin grid array (PGA), in which connecting solder balls are arranged in an array form or in a matrix form as electrodes, or a land grid array (LGA), in which solder balls are not mounted.
For these IC packages, the pitch between the electrodes tends to decrease from 1.0 mm to 0.8 mm to 0.5 mm with the densification of semiconductor devices.
Generally, the semiconductor devices are subject to a burn-in test after being manufactured. In the burn-in test, a semiconductor device is mounted on an IC socket and heated under predetermined conditions to check the electrical properties thereof.
Conventionally, for the IC socket, contact pins in contact with the electrodes of semiconductor device are embedded in a synthetic resin so that the pitch thereof is equal to that of the electrodes of semiconductor device. One end of the contact pin comes into contact with the electrode of semiconductor device, and a leg extending to the outside of socket at the other end is inserted into and connected to a printed board, and further connected to an external tester or the like.
This printed board not only is a wiring board but also has a function of enlarging and changing the minute pitch of contact pins, which has been set so as to be equal to the pitch between electrodes of semiconductor device, to a pitch between connecting terminals for the external tester or the like. For example, the pitch of contact pins of 1.0 mm is enlarged and changed to 1.27 mm or 2.54 mm, the pitch between connecting terminals for the external tester, or when the electrode arrangement of semiconductor device is of a matrix form, the arrangement of contact pins is enlarged and changed in the matrix form, or the arrangement itself is changed.
As the pitch between electrodes of semiconductor device decreases and a two-dimensional electrode arrangement such as a matrix-form arrangement is used, a multilayer printed board of 4 to 8 layers or 10 layers etc. must be used as a printed board for enlarging and changing the pitch of contact pins in the IC socket.
However, if the printed board is made multilayered, there arises a problem in that the manufacturing cost increases, and therefore the cost required for the burn-in test of the semiconductor device also increases.
The present invention was made in view of the above situation, and accordingly an object thereof is to provide an IC socket capable of inspecting the electrical properties of a semiconductor device at a low cost without using an expensive multilayered printed board.
DISCLOSURE OF THE INVENTION
To achieve the above object, the present invention provides an IC socket having a plurality of contact pins, in which the plural contact pins are arranged in a matrix form so that the pitch thereof at one end agrees with the electrode pitch of a semiconductor device to be mounted and the pitch at the other end agrees with the pitch of the electrical connection terminals of an external connection body to be connected.
Preferably, the plural contact pins are formed by a plurality of lead frames each having a plurality of leads arranged in parallel in a single plane, the pitch of the plural leads of each lead frame on one side agrees with the electrode pitch of the semiconductor device to be mounted and the pitch thereof at the other end agrees with the pitch of the electrical connection terminals of the external connection body to be connected, and one end side and the other end side of the plural leads are bent substantially in parallel via a step portion with respect to the single plane, by which the plural contact pins are formed by stacking said lead frames.
Also preferably, each of the lead frames is formed with a spring portion formed in an arcuate shape on one end side of t
REFERENCES:
patent: 4593463 (1986-06-01), Kamono et al.
patent: 4806104 (1989-02-01), Cabourne
patent: 4871316 (1989-10-01), Herrell et al.
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5247250 (1993-09-01), Rios
patent: 5342206 (1994-08-01), Grabbe et al.
patent: 5902144 (1999-05-01), Hay
Ono Kazuto
Sakata Masato
Yuzawa Hitoshi
Zama Satoru
Furukawa Electric Co. Ltd.
Luebke Renee
Patel T. C.
LandOfFree
IC socket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC socket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2095090