Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-06-24
1995-03-07
Schwartz, Larry I.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439330, 439525, H05K 100
Patent
active
053952553
ABSTRACT:
An IC socket includes a socket board having a plurality of contacts, and an IC platform vertically movably disposed on the socket board and adapted to support thereon an IC having a plurality of leads projecting sidewards from a body thereof so as to be contacted with the contacts. Inclined wall surfaces are formed at both ends of a row of the contacts and are adapted to guide the leads onto vertical wall surfaces formed at lower ends of the inclined wall surfaces. To this end, the contacts at the ends of the row are guided onto the vertical wall surfaces by the inclined wall surfaces when the IC platform with the IC body supported thereon is lowered, so that the leads are brought into contact with the contacts. The IC socket further includes a plurality of projections formed on an upper surface of the IC platform and adapted to support a lower surface of the IC body such that the lower surface of the IC body floats above the upper surface of the IC platform, such that the leads are not supported on a marginal wall projecting upwardly from a marginal portion of the IC platform, and such that a ventilation space or gap is formed between the lower surface of the IC body and the upper surface of the IC platform.
REFERENCES:
patent: 4846703 (1989-07-01), Matsuoka et al.
patent: 4887969 (1989-12-01), Abe
patent: 4984991 (1991-01-01), Nishimoto
patent: 5100332 (1992-03-01), Egawa
Schwartz Larry I.
Vu Hien D.
Yamaichi Electric Co., Ltd.
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