Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-01-28
1999-07-20
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439631, H01R 909
Patent
active
059248742
ABSTRACT:
There is provided an IC socket capable of reducing inductance of contacts corresponding to a power supply pin and a ground pin of an IC, of increasing the level of impedance matching and of enabling the measurement of a high frequency IC. Contacts each formed of a single kind and comprising three contact portions and one curved portion are arranged in a straight line along grooves of an IC socket and the contacts are connected to a measuring circuit board which is inserted into the grooves of the IC socket through the three contact portions regardless of the curved portion.
REFERENCES:
patent: 4897054 (1990-01-01), Gilissen et al.
patent: 4941832 (1990-07-01), Korsunsky et al.
patent: 5067904 (1991-11-01), Takeuchi et al.
patent: 5576937 (1996-11-01), Kubo
Gotoh Yoshihiro
Kawanishi Yuji
Ohtaka Katsuhiro
Abrams Neil
Ando Electric Co. Ltd.
Patel T C
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