Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-02-28
1997-11-11
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439482, H01R 909
Patent
active
056857250
ABSTRACT:
An IC socket is equipped with a plurality of elastic contact pins which are brought into contact with spherical bumps of an IC package. Each of the contact pins has at a foremost end thereof a contacting portion disposed opposite to a lower spherical surface of the spherical bump. The contacting portion has a relief portion which is kept in a non-contacting condition relative to a lower dead point portion on the lower spherical surface of the spherical bump, and a contacting end is brought into press contact at an area thereof around the relief portion with that area of the spherical surface of the spherical bump outwardly adjacent to the lower dead point.
REFERENCES:
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patent: 4468072 (1984-08-01), Sadigh-Belzadi
patent: 4773877 (1988-09-01), Kruger et al.
patent: 4963822 (1990-10-01), Prokopp
patent: 5045780 (1991-09-01), Swart
patent: 5114358 (1992-05-01), Myers
patent: 5247250 (1993-09-01), Rios
patent: 5419710 (1995-05-01), Pfaff
Nguyen Khiem
Yamaichi Electronics Co. Ltd.
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