IC socket

Details IC socket IC socket

1994-10-07

1996-08-13

Vu, Hien D.

Electrical connectors

With coupling movement-actuating means or retaining means in...

For dual inline package

439 73, H01R 1362

Patent

active

055450504

ABSTRACT:
Disclosed is an IC socket for use in testing IC packages, comprising a socket body having a plurality of Y-shaped contact pieces so arranged as to permit them to contact the lead conductors of an IC packages to be tested and a lid which is spring-biased so as to rise up, and is responsive to application of a push for closing and covering the top of the socket body while pushing the lead conductors of the IC package against the contact pieces. the V-shaped head of the contact piece body has the effect of increasing the flexibility with which it accommodates a selected lead conductor, thus assuring that good contact can be made between the lead conductor, thus assuring that good contacts can be made between the lead conductors of the IC package and the contact pieces of the IC socket even after the IC socket is used many times.

REFERENCES:
patent: 4750891 (1988-06-01), Egawa
patent: 4758176 (1988-07-01), Abe et al.
patent: 5167515 (1992-12-01), Matsuoka et al.
patent: 5213531 (1993-03-01), Matsuoka et al.
patent: 5399108 (1995-03-01), Lu et al.

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