Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-03-05
1998-11-03
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439266, H01R 909
Patent
active
058299890
ABSTRACT:
An IC socket has a guide onto at least one of opposite corners, and the guide is provided with a vertical face portion of such a height that it is capable or coming in contact with one of the leads of an IC package loaded and accurately restricting the position where the IC package is loaded. Instead or some of a plurality of contact pins arranged along the sides of a rectangular base member, a guide member removably mounted to the base member is provided. BY this guide member, a region smaller in size than a normal region can be defined on the base member, and the IC socket capable of loading IC packages or different sizes is provided.
REFERENCES:
patent: 4691975 (1987-09-01), Fukunaga et al.
patent: 5009609 (1991-04-01), Matsuoka et al.
patent: 5348483 (1994-09-01), Sagano
Kashiwagi Tsutomu
Tachihara Tetsuo
Enplas Corporation
Nguyen Khiem
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