IC socket

Electrical connectors – With coupling movement-actuating means or retaining means in... – For dual inline package

Patent

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Details

439 72, 439 73, H01R 909

Patent

active

047581760

ABSTRACT:
An IC socket includes a socket body which has an IC package placing area and resilient contacts around the IC package placing area, a cover pivotally attached to the socket body, a lock member pivotally attached to either the socket body or the cover for locking/unlocking the cover relative to the socket body, and IC lead pressing means movably mounted on the cover. The IC lead pressing means is provided integrally with pads for pressing the IC leads against the resilient contacts and is adapted to effect self-adjustment of its own movement so that the pads come into uniform contact with the IC leads.

REFERENCES:
patent: 4502747 (1985-03-01), Bright et al.
patent: 4515424 (1985-05-01), Sakurai
patent: 4657328 (1987-04-01), Matsuoka
patent: 4688870 (1987-08-01), Egawa et al.

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