IC socket

Electrical connectors – With coupling movement-actuating means or retaining means in... – For dual inline package

Patent

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Details

439526, H01R 1362

Patent

active

056094973

ABSTRACT:
A guide component, which supports a pressing member such that it can slide up and down at a specific location over an IC, is provided to the inner side of a cover lid 20, and a pressing component is formed on the pressing member 24 side of the cover lid, so that when the socket substrate is closed by the cover lid, the pressing member is supported in a state in which it can only slide up and down at a specific location over the IC, and the pressing member is pressed perpendicularly while the pressing component slides over the back surface of the pressing member.

REFERENCES:
patent: 4758176 (1988-07-01), Abe et al.
patent: 4840576 (1989-06-01), Nierescher et al.
patent: 5100332 (1992-03-01), Egawa
patent: 5244404 (1993-09-01), Kishi et al.
patent: 5460538 (1995-10-01), Ikeya

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